us currency digital center- Top searches

Kuwait set the price of crude oil sold to the Mediterranean region and northwest Europe in January at a discount of $4.90 per barrel.Bank of New York Mellon: As the impact weakens, the won may rebound to 1,400 won against the US dollar. Bank of New York Mellon said that as the most serious political impact caused by the short-term declaration of martial law begins to ease, the won may recover some of its recent lost ground before the end of the year. As the political risk premium begins to fall, the won may appreciate to 1,400 against the US dollar.The USD/JPY rose more than 30 points against the Japanese yen in the short term and is now reported at 152.56.

Li Bin: Fang Hongbo, chairman of Midea, will be the chief experience officer of Weilai ET9 and will test drive together. Li Bin, founder, chairman and CEO of Weilai, announced that Weibo said that Fang Hongbo, chairman of Midea, will be the chief experience officer of Weilai ET9 and test drive this upcoming administrative flagship together. Li Bin said that he asked Fang Hongbo three questions, and Fang Hongbo's answer about market competition was very good: "Actively participate in involution, compare cost and efficiency, and at the same time bravely jump out of involution, don't roll on the floor, and pierce the ceiling." (Sina Technology)Xia Yiping's internal letter was alleged to have been copied from Weilai Li Bin. Xia Yiping, CEO of Jiyue, released an internal letter on the afternoon of 11th, acknowledging that the company was encountering difficulties and needed to adjust immediately. Some netizens pointed out that part of Xia Yiping's internal letter copied the internal letter of Weilai Li Bin in 2023. Xia Yiping's internal letter mentioned that the following four things must be done well in the new entrepreneurial period: 1. Adhere to the long-term investment in core technologies to maintain the leading edge; 2. Strengthen sales and service capacity building to cope with fierce market competition; 3. Merge departments and posts with duplicate functions and change inefficient internal workflow; 4. Reduce projects that cannot improve financial performance in the short term. In 2023, Li Bin's internal letter also mentioned: ensure long-term investment in core key technologies and maintain the leading edge of technology and products; Ensure that sales and service capabilities can cope with fierce market competition; Ensure that 9 core products of 3 brands are listed as scheduled; Organize efficiency improvement, merge redundant departments and posts, change inefficient internal workflow and division of labor, and cancel inefficient posts; Improve the efficiency of resources, postpone and reduce the project investment that can not improve the company's financial performance within 3 years. (Sina Technology)Intel: Breakthrough progress has been made in chip interconnection, and the inter-line capacitance has been reduced by 25%. Recently, Intel OEM announced a major breakthrough in on-chip interconnection technology. The latest subtractive Ruthenium interconnection technology of the company can reduce the inter-line capacitance by up to 25%, effectively improving the on-chip interconnection. According to reports, the subtractive ruthenium interconnection technology has achieved great progress in interconnection miniaturization by using ruthenium, a new, key and alternative metallization material, and using thin film resistivity and airgap. This process does not need an expensive photolithographic air gap exclusion zone around the via, and it can also avoid using a self-aligned via that is selectively etched. When the spacing is less than or equal to 25 nm, the air gap realized by reducing ruthenium interconnection technology can reduce the capacitance between lines by up to 25%, which can be used as a metallization scheme to replace copper damascene process in closely spaced layers. It is reported that this solution is expected to be applied in the future process nodes of Intel OEM. (Sina Technology)

Spring Festival travel rush's first day train tickets will be sold on 31st of this month. The student booking service was launched today. It was learned from China State Railway Group Co.,Ltd. today (12th) that Spring Festival travel rush will be launched on 14th of January next year in 2025, and Spring Festival travel rush's first day train tickets will be sold on 31st of this month. In view of students booking tickets during Spring Festival travel rush, Railway 12306 launched a new function today.New Zealand plans to modify the "golden visa" to attract wealthy immigrants, and the New Zealand government is planning to modify its so-called "golden visa" program to attract more wealthy immigrants to invest in New Zealand. The Active Investor Plus Visa has always attracted the rich to New Zealand, bringing an average of NZ $1 billion (US$ 580 million) to New Zealand every year, but it has been sluggish since the rules changed in 2022. According to the data of Immigration New Zealand, in the past two years, only 35 applications have been fully approved, equivalent to NZ $352 million in nominated investment funds. In an interview in Wellington on Thursday, Finance Minister Nicola Willis said, "We realized that the previous government changed these settings, and we saw a significant drop in the number of investors. You can expect to see our announcement in this regard in the next few weeks. "Intel: Breakthrough progress has been made in chip interconnection, and the inter-line capacitance has been reduced by 25%. Recently, Intel OEM announced a major breakthrough in on-chip interconnection technology. The latest subtractive Ruthenium interconnection technology of the company can reduce the inter-line capacitance by up to 25%, effectively improving the on-chip interconnection. According to reports, the subtractive ruthenium interconnection technology has achieved great progress in interconnection miniaturization by using ruthenium, a new, key and alternative metallization material, and using thin film resistivity and airgap. This process does not need an expensive photolithographic air gap exclusion zone around the via, and it can also avoid using a self-aligned via that is selectively etched. When the spacing is less than or equal to 25 nm, the air gap realized by reducing ruthenium interconnection technology can reduce the capacitance between lines by up to 25%, which can be used as a metallization scheme to replace copper damascene process in closely spaced layers. It is reported that this solution is expected to be applied in the future process nodes of Intel OEM. (Sina Technology)